Nitrogen
It is used as carrier gas for overall protection against impurities and oxidation in the semiconductor and soldering processes. In its cold, liquid form, it is used as a cooling medium in the Environmental Testing of electronic devices.
Argon
It is used as carrier and inert gas in semiconductors and also as a process gas for sputtering, reactive ion etching and plasma processing.
Hydrogen
It is used as a carrier gas in semiconductor processes and as a scavenger gas in atmosphere soldering and for annealing copper films. The use of forming gases (that is Hydrogen diluted in Nitrogen) allows virtually a complete elimination of oxygen and the inconveniences in medium to high temperature processes.
Oxygen
Ultra-pure oxygen is used to oxidize certain materials, such as Si to SiO2, ashing of photoresist and to achieve chemical vapor deposition of oxides. It is also used to make ozone for oxidations or cleaning.
Carbon Dioxide
It has several applications in electronics manufacturing - a) waste water treatment ; b) as a cooling medium in Environmental Testing of electronic devices ; c) add conductivity to ultrapure water ; d) snow abrasive cleaning of parts or residues on wafers ; and e) as an environmentally friendly supercritical fluid for removing photoresist from wafers, thus avoid organic solvent use.
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