Wave Soldering under Nitrogen  [ Return towards  Applications  ]

On The Forefront, Circuits Assembly Magazine, August 2000

The use of nitrogen for inert soldering in the assembly of PCBs continues to increase globally for both wave and reflow soldering operations. More and more, assemblers are recognizing that inert soldering not only improves joint quality and yield but also reduces sensitivity to process variables and fluctuations ('process window widening').

Using nitrogen for inert soldering does not only increase yield and improve quality, it is also cost-effective. The savings are brought about as nitrogen diminishes the usage and labor costs, especially in the wave soldering process where dross and its negative effects are dramatically reduced.

In wave soldering, nitrogen eliminates oxidation and increases the surface tension on the solder material.

Dross under Air

Dross under N₂

Benefits of Nitrogen / Inert Wave Soldering

• Reduced dross;
• Reduced solder pot maintenance – higher uptime;
• Reduced flux consumption (Spray fluxer, up to 60%);
• Flexibility – wider 'process window';
• Use of low solids;
• Reduced or eliminated cleaning;
• Reduced dross-related defects;
• Reduced defects / increased yield;
• Increased joint reliability; and
• ISO 14,000 compliance.

Your existing wave soldering machines can be retrofitted to nitrogen-capable.