IC Packaging  [ Return towards  Applications  ]

There are several reasons why an Integrated Circuit (IC) is packaged:

• To provide for electrical interconnection (both power and distribution);
• To allow for efficient heat dissipation; and
• To physically support and protect the IC.

Since there are many different types of ICs, there are also many different types of packaging. From Ball Grid Array (BGA) to Small Outline (SO), the complexity of the packaging depends on the application and complexity of the IC.

The current advances in packaging technology, especially in Chip Scale Packages (CSP), are leading to packages with smaller pitches and more complex designs.

Nitrogen has become a key element  to prevent these problems by creating an inert area around the process that is free of moisture and other impurities. In addition, the use of different gas mixtures such as H₂/N₂, as well as different plasma formulations have proven to be effective in removing oxides and other organic impurities that will improve the process. 

In the production of these advanced packages, as well as traditional packages, the presence of moisture and oxides can lead to reductions in yields. Oxides can inhibit many of the different bonding steps, such as wire bonding or die attach, while moisture can get trapped in small areas of the package and create failures when any reflow or curing step is done.