Air Liquide Electronics Completes Expansion of ALOHA Production

The successful completion of expansions at its ALOHA manufacturing sites enables Air Liquide to double its production capacity of advanced precursors and bring multiple products online to its semiconductor customers worldwide.

A new laboratory dedicated to joint development projects with customers and technology providers is also set up at the Fremont, California facility.

As semiconductor manufacturing is well into nanoscale levels, Air Liquide’s precursor technology has helped increase the electrical and mechanical performance of film materials used in microelectronics fabrication, accelerating a variety of emerging applications.

The range of highly engineered precursors currently ramping up at ALOHA™ facilities include:

• ZyALD^TM, ALOHA’s proprietary precursor for second generation ZrO₂ high-k materials for advanced DRAM, for which critical Intellectual Property has recently been granted
• Silicon precursors for a variety of sub 32nm applications such as patterning and gapfill, used in memory and high-end logic chips   
• High-k/ metal gate precursors now qualified on major OEM platforms
• Metallization precursors for applications ranging from copper capping or barrier layers to DRAM capacitor electrodes, including expansion of TORUS^TM production capacity for Ruthenium metallization.
• Low-k precursors and ancillary materials for advanced back-end dielectric stacks
• New materials for new devices such as Resistive (ReRAM) and Phase Change (PCRAM) memory devices.

Francisco Martins, Vice President of Air Liquide Electronics said, “Air Liquide’s strong investment in advanced and differentiated products to meet cutting-edge semiconductor technologies is paying off. Our ALOHA family is playing an increasingly important role in the technology ecosystem and we are committed to supporting and growing with technology providers globally. The additional capacity and the next generation products in the pipeline will enable our customers to meet their technology roadmap challenges.   ”